About this job
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life for all.
The Technology Development (R&D) organization is responsible for developing innovative memory and storage technologies that enable next-generation semiconductor products. The Wafer Bonding team focuses on advancing wafer bonding processes and equipment, driving technology acceleration, manufacturability, and performance improvements through research, experimentation, and collaboration across engineering fields. As a Wafer Bonding Process Development Intern based in Boise, Idaho, you will contribute to the research, development, and optimization of advanced wafer bonding technologies that support future semiconductor products.
Working alongside experienced engineers and researchers, you will design and execute experiments, evaluate new process solutions and equipment, and analyze data to improve process performance, yield, quality, and manufacturability. This internship offers a chance to apply scientific and engineering principles in a modern R&D environment. It involves using Artificial…
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Where the job is
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